Place on target's outermost signal layer #936
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In place_in_layout_3d_placement use the signal layers rather than the stackup layers of the target to determine the top/bottom placement layer to handle cases where dielectric layers are outside the metal layers. For example, this occurs when a soldermask or mold compound is present.
Codecov Report
@@ Coverage Diff @@
## main #936 +/- ##
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+ Coverage 80.21% 80.23% +0.01%
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Files 128 128
Lines 37419 37468 +49
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+ Hits 30015 30061 +46
- Misses 7404 7407 +3 |
Add a test for correct placement when the source design is unflipped and the target design has a dielectric layer on the bottom. To get it working remove the dielectric elevation calculation from the Z-offset calculation in place_in_layout_3d_placement and then clean up unused top/bottom signal layers from the source stackup. Behavior now should be to align the top/bottom source stackup layer with the top/bottom target signal layer depending on the values of (flipped_stackup, place_on_top).
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In place_in_layout_3d_placement use the signal layers rather than the
stackup layers of the target to determine the top/bottom placement layer
to handle cases where dielectric layers are outside the metal layers.
For example, this occurs when a soldermask or mold compound is present.